Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1!

DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools:

iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the last 32 years.

And for 2024 : iMIPlasmaXL™ for Large PCB

With the help of our worldwide Customers and the knowledge of all the sample preparation ways, we always introduce 5 years before the new techniques on the market.

FA, QA, Forensics, counterfeit needs … SIP, 3D, WLCSP with one goal … no artifact adding during the DCapsulation.

We like new challenges, so please come and show yours.

Have a great ISTFA2024 with DC.

New for 2024 iMIP II XL™ 

Atmospheric DCapsulation of IC on Board.

Maximum size 300x300mm (12"x12")

Thanks for your welcoming and discussions about iMIP II™

Thanks to all visitors and meet you soon.

We was at ESREF were we demonstrated the SLP500™ LASER.

iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too.

Thanks to all for your visit.

We was at CAM Workshop were we demonstrated the SLP500™ LASER.

iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too.

Thanks to all for your visit.

2021 December

iMIP Release II

More Green ...

... More options :).

iSA: iPanel™ Sesame Acids

The best Automated Decapsulation System we have designed.

More ...

• Safe
• Robust
• Easy to use with iPanel™
• Software and Hardware easy to Up-Grade in site
• and more than Moore ...

APRIL 2019 : Introduction of iCEMIP XL for Large PCB

Presentation on request.

This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in order to com- plete it more quickly and consistently after decapsulation.

A copy will be send on request.

Advanced decapsulation systems with 

• iCE for MIP (iPanel Cold Etching Microwave Induced Plasma)
• iGPS for ACID

New SesameMICROMACHINING

• SESAMEPLASMA™ - New ICEMIP for ESREF2018

• SESAMEACID™ - New ISA777 for ESREF2018

• SESAMELASER™ - New DeCap Software for ESREF2018

• SESAMELASER™ - New SL_MicroMachining before FIB for ESREF2018

• SESAMEMECHANICAL™

• SESAMETHERMAL™

• iPanel ™

UP-GRADE or TRADE-IN your old equipment with thelast technics 

… with … New iPanel™ and Options

See our last researchpresented at IPFA, ISTFA, ESREF

iCEMIP introduction at IPFA2018 Singapore

Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA)  5-9 November 1-5, 2017.

All the DC Team we will be glad to meet you at our Booth 209  and to show you our last products.

2016 booth 

Welcome at ESREF 2017, we will be please to meet you at our Booth 23.

Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz.

This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.

Welcome at ESREF 2016, we will be please to meet you at our Booth 32-33 at the first floor.

Come to see our Acid and Mechanical Upgrades with our iPanel^tm and our LASER demos.

Digit Concept Asia Pacific will attend the 23^rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18^th to 21^th July 2016.

All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and developments based on our new iPanel^tm.

Digit Concept will attend the 17^th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015.

All the DC Team we will be gald to meet you and to show you our last products.

If you have questions on Cu or Ag wires decapsulation, don't hesitate to ask us our recipes, or meet us during the poster session the 4th of december, we will present a poster titled : New decapsulation methods for ICs with Cu and Ag wires.

Digit Concept will attend the 41^st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA)  1-5 November 1-5, 2015.

All the DC Team we will be gald to meet you at our Booth 337  and to show you our last products.

Don't miss our presentation during the session "Sample Preparation and Device Deprocessing II", Thursday, November 5, 2015 at 12:40 PM, titled: LASER combined with Plasma will it be the future green and safe ICs decapsulation method?

DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP).

After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag ...). 

The SLP500DC is based on our SL500DC platform.  It combines a high performance IR Fiber LASER with Radio Frequency or Micro Wave Plasma (RFP/MWP). This SLP is based on our joint patent with the CNES Toulouse (Fr) - WO 2008/090281.

The SLP500DC provide 3 technics to solve mainly all your needs

• Atmospheric Radio Frequency Plasma (ARFP) and Micro Wave Plasma (AMWP)

• Vacuum Radio Frequency Plasma (VRFP) and Micro Wave Plasma (VMWP)

• Control of the Plasma obtained from the LASER ablation process

SLP500DC Platform

• 3 in 1 system: The SLP500DC is our third LASER IC decapsulator basic platform. It can also integrate a cross section option for ICs, modules and PCBs. In addition, a Plasma option module can be added to become the SLP500DC

• Flexible and Reliable : The SLP500C integrates a 10W IR Fiber LASER on basis. 4 Power LASER and 4 lenses are available to meet all you requirements. The SLP500DC is equipped with a Live vision camera with Fast Z adjustment and a Coaxial camera with High Mag and FOV on request. The SLP500DC have a 2 years Warranty.

• Easy and Safe: The SLP500DC is a compact system, very easy to move. It can be installed everywhere in a workshop or on a production line and  needs a simple mono-phased electric plug 110/220V - 50/60Hz. Plug it, you are ready to start

SLP500DC, THE FLEXIBILITY TO SUIT YOUR APPLICATION

Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information ... FFWD

The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results -- especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final decapsulation. The technique can be seen as a "Swiss knife" in many labs and many openings start with a LASER step today. This presentation also reviewed several case studies .

Digit Concept Asia will be pleased to introduce our equipment for failure analysis and plasma treatment at SEMICON China 2013. Come and visit us at the booth #2812.