ISTFA2014

09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA)  5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209  and to show you our last products.

11/01/2014

07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…

04/16/2019 Advanced decapsulation systems with  New SesameMICROMACHINING

05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).  

07/16/2024 New for 2024 iMIP II XL™  Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)