Fast Forward Normandie – Season 1
03/18/2015
Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
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ISTFA 2017
09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA) 5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209 and to show you our last products.
IPFA Malaysia 2023
08/22/2023 Thanks for your welcoming and discussions about iMIP II™
SLP500DC
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
Laser Chip Access
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
ESREF 2017
09/01/2017 Welcome at ESREF 2017, we will be please to meet you at our Booth 23.
DC @ ISTFA2024 50th
09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…