Fast Forward Normandie – Season 1
03/18/2015

Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
03/18/2015

Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
09/29/2022 We was at ESREF were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
07/16/2024 New for 2024 iMIP II XL™ Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)
11/01/2014 Digit-Concept participated in ESREF 2014, an international conference dedicated to reliability and failure analysis in electronic systems. This event provided an opportunity for the company to present its expertise and innovative solutions to a specialized audience. ESREF 2014 also enabled Digit-Concept to meet industry professionals, researchers, and key players in the field. The event…