ISTFA2018

05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).  

07/16/2024 New for 2024 iMIP II XL™  Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).  The SLP500DC is based on our SL500DC…

09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA)  5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209  and to show you our last products.

11/01/2014

09/29/2022 We was at ESREF were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.