ISTFA2018

04/16/2019
Advanced decapsulation systems with
- iCE for MIP (iPanel Cold Etching Microwave Induced Plasma)
- iGPS for ACID
New SesameMICROMACHINING

04/16/2019
Advanced decapsulation systems with
New SesameMICROMACHINING
09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…
05/22/2025 We have shown for the first time the results of DCapsulation with the new iMIP XL™ already installed at customers’ plants in 2024. This one allows DCap an IC on a large board (300x300mm). This is a World Premiere ;).
06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
07/16/2024 New for 2024 iMIP II XL™ Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)
🔬 A Look Back at ESREF 2026 in Vienna! The Digit Concept team was delighted to participate in the ESREF 2026 conference, held October 21–24 in Vienna, Austria. A big thank you to everyone who came to meet Alban Poquerusse and Elouan Le Ny, our two engineers in attendance, to discuss our areas of expertise,…
08/22/2023 Thanks for your welcoming and discussions about iMIP II™