SemiconChina2014
11/01/2014


11/01/2014


05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).
08/22/2023 Thanks for your welcoming and discussions about iMIP II™
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA) 1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337 and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…
04/16/2019 Advanced decapsulation systems with New SesameMICROMACHINING
10/1/2020 iSA: iPanel™ Sesame Acids The best Automated Decapsulation System we have designed. More …
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.