SEMICON China 2013 : booth #2812

11/01/2014 Digit-Concept participated in the 2014 edition of ISTFA, a major international event dedicated to test and failure analysis technologies. This participation gave the company an opportunity to showcase its expertise and innovative solutions in the field of electronics. ISTFA 2014 was also an excellent opportunity to meet industry professionals and key players in the…

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…

04/16/2019 This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in…

06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.

07/16/2024 New for 2024 iMIP II XL™  Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

04/16/2019 iCEMIP introduction at IPFA2018 Singapore