SEMICON China 2013 : booth #2812

07/01/2022 We was at CAM Workshop were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.

09/01/2017 Welcome at ESREF 2017, we will be please to meet you at our Booth 23.

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…

07/16/2024 New for 2024 iMIP II XL™  Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

04/16/2019 This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in…

05/22/2025 We have shown for the first time the results of DCapsulation with the new iMIP XL™ already installed at customers’ plants in 2024. This one allows DCap an IC on a large board (300x300mm). This is a World Premiere ;).