SEMICON China 2013 : booth #2812

Two engineers from Digit-concept—Alban Poquerusse and Elouan Le Ny—attended this 20th edition of Anadef. Once again, this edition of Anadef was rich in discussions and presentations on the field of semiconductor failure analysis. In particular, our two colleagues presented a case study involving etching using both the acid etching method (ISA 777) and the atmospheric…

04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics  … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF

10/1/2020 iSA: iPanel™ Sesame Acids The best Automated Acid Decapsulation System we have designed. More …

04/16/2019 iCEMIP introduction at IPFA2018 Singapore

09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…

04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…