EPTC 2015

11/25/2015

Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015.

All the DC Team we will be gald to meet you and to show you our last products.

If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during the poster session the 4th of december, we will present a poster titled : New decapsulation methods for ICs with Cu and Ag wires.

Publications similaires

  • ISTFA 2015

    10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA)  1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337  and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…

  • SemiconChina2014

    11/01/2014 Digit-Concept participated in SEMICON China 2014, one of the leading international events for the semiconductor industry. This participation provided the company with an opportunity to showcase its expertise and solutions to professionals from across the semiconductor sector. The event brought together major industry players, technology providers, and experts from around the world. It was…

  • IPFA 2016

    07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…

  • ESREF2018

    04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics  … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF