IPFA2024 iMIP II XL™
07/16/2024

New for 2024 iMIP II XL™
Atmospheric DCapsulation of IC on Board.
Maximum size 300x300mm (12″x12″)
07/16/2024

New for 2024 iMIP II XL™
Atmospheric DCapsulation of IC on Board.
Maximum size 300x300mm (12″x12″)
10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA) 1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337 and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
04/16/2019 iCEMIP introduction at IPFA2018 Singapore
11/01/2014
09/29/2022 We was at ESREF were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.
Two engineers from Digit-concept—Alban Poquerusse and Elouan Le Ny—attended this 20th edition of Anadef. Once again, this edition of Anadef was rich in discussions and presentations on the field of semiconductor failure analysis. In particular, our two colleagues presented a case study involving etching using both the acid etching method (ISA 777) and the atmospheric…
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.