Fast Forward Normandie – Season 1

05/22/2025 We have shown for the first time the results of DCapsulation with the new iMIP XL™ already installed at customers’ plants in 2024. This one allows DCap an IC on a large board (300x300mm). This is a World Premiere ;).  

07/16/2024 New for 2024 iMIP II XL™  Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics  … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF

04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…

Two engineers from Digit-concept—Alban Poquerusse and Elouan Le Ny—attended this 20th edition of Anadef. Once again, this edition of Anadef was rich in discussions and presentations on the field of semiconductor failure analysis. In particular, our two colleagues presented a case study involving etching using both the acid etching method (ISA 777) and the atmospheric…

11/01/2014 Digit-Concept participated in the 2014 edition of ISTFA, a major international event dedicated to test and failure analysis technologies. This participation gave the company an opportunity to showcase its expertise and innovative solutions in the field of electronics. ISTFA 2014 was also an excellent opportunity to meet industry professionals and key players in the…