IPFA 2017
06/01/2017

Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz.

This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
06/01/2017

Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz.

This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
11/01/2014
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
04/16/2019 This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in…
08/22/2023 Thanks for your welcoming and discussions about iMIP II™
04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF