IPFA 2017
06/01/2017
Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz.

This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
06/01/2017
Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz.

This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…
04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF
11/01/2014 Digit-Concept participated in SEMICON China 2014, one of the leading international events for the semiconductor industry. This participation provided the company with an opportunity to showcase its expertise and solutions to professionals from across the semiconductor sector. The event brought together major industry players, technology providers, and experts from around the world. It was…
12/13/2021 2021 December iMIP Release II Atmospheric plasma decapsulation, a new cleaning method, and more recipe options. More Green … … More options :).
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…