ESREF 2016
09/18/2016

Welcome at ESREF 2016, we will be please to meet you at our Booth 32-33 at the first floor.
Come to see our Acid and Mechanical Upgrades with our iPaneltm and our LASER demos.
09/18/2016

Welcome at ESREF 2016, we will be please to meet you at our Booth 32-33 at the first floor.
Come to see our Acid and Mechanical Upgrades with our iPaneltm and our LASER demos.
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.
03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
09/01/2017 Welcome at ESREF 2017, we will be please to meet you at our Booth 23.
11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…
12/13/2021 2021 December iMIP Release II More Green … … More options :).
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.