ESREF2022

04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).  The SLP500DC is based on our SL500DC…

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…

11/01/2014

07/01/2022 We was at CAM Workshop were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.

09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…

12/13/2021 2021 December iMIP Release II More Green … … More options :).