ESREF2022
09/29/2022
We was at ESREF were we demonstrated the SLP500™ LASER.
iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too.
Thanks to all for your visit.
Publications similaires
IPFA2024 iMIP II XL™
07/16/2024 New for 2024 iMIP II XL™ Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)
IPFA2018
04/16/2019 iCEMIP introduction at IPFA2018 Singapore
SLP500DC
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
IPFA 2016
07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…
Fast Forward Normandie – Season 1
03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
ISTFA2018
04/16/2019 Advanced decapsulation systems with New SesameMICROMACHINING