09/14/2017
Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA) 5-9 November 1-5, 2017.
All the DC Team we will be glad to meet you at our Booth 209 and to show you our last products.
07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…
07/16/2024 New for 2024 iMIP II XL™ Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)
11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…
11/01/2014
10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA) 1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337 and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…
05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.