IPFA 2017

11/01/2014 Digit-Concept participated in ESREF 2014, an international conference dedicated to reliability and failure analysis in electronic systems. This event provided an opportunity for the company to present its expertise and innovative solutions to a specialized audience. ESREF 2014 also enabled Digit-Concept to meet industry professionals, researchers, and key players in the field. The event…

04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).  The SLP500DC is based on our SL500DC…

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…

12/13/2021 2021 December iMIP Release II Atmospheric plasma decapsulation, a new cleaning method, and more recipe options.  More Green … … More options :).

08/22/2023 Thanks to all visitors and meet you soon.

09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA)  5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209  and to show you our last products.