IPFA 2017

09/18/2016 Welcome at ESREF 2016, we will be please to meet you at our Booth 32-33 at the first floor. Come to see our Acid and Mechanical Upgrades with our iPaneltm and our LASER demos.

05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).  

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…

07/16/2024 New for 2024 iMIP II XL™  Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA)  1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337  and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…

03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD