IPFA2018

11/01/2014

04/16/2019 Advanced decapsulation systems with  New SesameMICROMACHINING

09/01/2017 Welcome at ESREF 2017, we will be please to meet you at our Booth 23.

04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics  … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF

07/16/2024 New for 2024 iMIP II XL™  Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

08/22/2023 Thanks to all visitors and meet you soon.