IPFA2018

08/22/2023 Thanks to all visitors and meet you soon.

04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…

09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…

10/1/2020 iSA: iPanel™ Sesame Acids The best Automated Acid Decapsulation System we have designed. More …

04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …).  The SLP500DC is based on our SL500DC…

11/01/2014 Digit-Concept participated in SEMICON China 2014, one of the leading international events for the semiconductor industry. This participation provided the company with an opportunity to showcase its expertise and solutions to professionals from across the semiconductor sector. The event brought together major industry players, technology providers, and experts from around the world. It was…