09/14/2017
Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA) 5-9 November 1-5, 2017.
All the DC Team we will be glad to meet you at our Booth 209 and to show you our last products.
04/16/2019 This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in…
07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…
07/16/2024 New for 2024 iMIP II XL™ Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)
04/16/2019 Advanced decapsulation systems with New SesameMICROMACHINING
11/01/2014
11/01/2014
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.