ISTFA2018

12/13/2021 2021 December iMIP Release II Atmospheric plasma decapsulation, a new cleaning method, and more recipe options.  More Green … … More options :).

07/16/2024 New for 2024 iMIP II XL™  Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.

09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…

11/01/2014 Digit-Concept participated in ESREF 2014, an international conference dedicated to reliability and failure analysis in electronic systems. This event provided an opportunity for the company to present its expertise and innovative solutions to a specialized audience. ESREF 2014 also enabled Digit-Concept to meet industry professionals, researchers, and key players in the field. The event…

04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…