ISTFA2018
04/16/2019
Advanced decapsulation systems with
- iCE for MIP (iPanel Cold Etching Microwave Induced Plasma)
- iGPS for ACID
New SesameMICROMACHINING
Publications similaires
ESREF2014
11/01/2014
DC @ CAM Workshop 2025 Germany
05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).
Fast Forward Normandie – Season 1
03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
iGPS EDFA Magazine
04/16/2019 This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in…
IPFA Malaysia 2023
08/22/2023 Thanks for your welcoming and discussions about iMIP II™
IPFA2024 iMIP II XL™
07/16/2024 New for 2024 iMIP II XL™ Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)