IPFA Malaysia 2023

04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics  … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF

03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD

04/16/2019 Advanced decapsulation systems with  New SesameMICROMACHINING

11/01/2014 Digit-Concept participated in the 2014 edition of ISTFA, a major international event dedicated to test and failure analysis technologies. This participation gave the company an opportunity to showcase its expertise and innovative solutions in the field of electronics. ISTFA 2014 was also an excellent opportunity to meet industry professionals and key players in the…

07/16/2024 New for 2024 iMIP II XL™  Atmospheric plasma DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…