04/16/2019
This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in order to com- plete it more quickly and consistently after decapsulation.
A copy will be send on request.
09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA) 5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209 and to show you our last products.
07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…