ESREF2018

08/22/2023 Thanks for your welcoming and discussions about iMIP II™

04/16/2019 Advanced decapsulation systems with  New SesameMICROMACHINING

11/01/2014 Digit-Concept participated in ESREF 2014, an international conference dedicated to reliability and failure analysis in electronic systems. This event provided an opportunity for the company to present its expertise and innovative solutions to a specialized audience. ESREF 2014 also enabled Digit-Concept to meet industry professionals, researchers, and key players in the field. The event…

09/19/2024 Excited to support the 50th International Symposiums for Testing and Failure Analysis (ISTFA)! As a sponsor, we’re committed to showcasing electronic device failure analysis resources and advancements. Catch us in San Diego, California, from Oct. 28 – Nov. 1! DC (Digit Concept SAS) Manufactures the 4 ways for IC DCapsulation tools: iMIPlasma™ – iSAcides™ – SLP LASER™ – iMill™ … from the…

10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA)  1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337  and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…

04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…