IPFA Malaysia 2023

05/22/2025 We have shown for the first time the results of DCapsulation with the new iMIP XL™ already installed at customers’ plants in 2024. This one allows DCap an IC on a large board (300x300mm). This is a World Premiere ;).  

06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.

09/29/2022 We was at ESREF were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.

04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…

Two engineers from Digit-concept—Alban Poquerusse and Elouan Le Ny—attended this 20th edition of Anadef. Once again, this edition of Anadef was rich in discussions and presentations on the field of semiconductor failure analysis. In particular, our two colleagues presented a case study involving etching using both the acid etching method (ISA 777) and the atmospheric…

08/22/2023 Thanks to all visitors and meet you soon.