CAM WORKSHOP 2023

04/16/2019 This article describes tests that were carried out by Digit Concept in order to understand and exploit this phe- nomenon. First, new and different methods of decapsula- tion by mixing acids and adjuvants will be reviewed. Next, the article will present a method of end-of-etch detection and how to improve the rinsing process in…

07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…

09/01/2017 Welcome at ESREF 2017, we will be please to meet you at our Booth 23.

03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD

07/16/2024 New for 2024 iMIP II XL™  Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)

11/01/2014