ESREF 2016
09/18/2016

Welcome at ESREF 2016, we will be please to meet you at our Booth 32-33 at the first floor.
Come to see our Acid and Mechanical Upgrades with our iPaneltm and our LASER demos.
09/18/2016

Welcome at ESREF 2016, we will be please to meet you at our Booth 32-33 at the first floor.
Come to see our Acid and Mechanical Upgrades with our iPaneltm and our LASER demos.
03/19/2013 Digit Concept Asia will be pleased to introduce our equipment for failure analysis and plasma treatment at SEMICON China 2013. Come and visit us at the booth #2812.
11/01/2014
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
11/01/2014
11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…
04/16/2019 • SESAMEPLASMA™ – New ICEMIP for ESREF2018 • SESAMEACID™ – New ISA777 for ESREF2018 • SESAMELASER™ – New DeCap Software for ESREF2018 • SESAMELASER™ – New SL_MicroMachining before FIB for ESREF2018 • SESAMEMECHANICAL™ • SESAMETHERMAL™ • iPanel ™ UP-GRADE or TRADE-IN your old equipment with thelast technics … with … New iPanel™ and Options See our last researchpresented at IPFA, ISTFA, ESREF
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.