ESREF 2017

04/16/2019 iCEMIP introduction at IPFA2018 Singapore

11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…

04/16/2019 Advanced decapsulation systems with  New SesameMICROMACHINING

11/01/2014 Digit-Concept participated in the 2014 edition of ISTFA, a major international event dedicated to test and failure analysis technologies. This participation gave the company an opportunity to showcase its expertise and innovative solutions in the field of electronics. ISTFA 2014 was also an excellent opportunity to meet industry professionals and key players in the…

🔬 A Look Back at ESREF 2026 in Vienna! The Digit Concept team was delighted to participate in the ESREF 2026 conference, held October 21–24 in Vienna, Austria. A big thank you to everyone who came to meet Alban Poquerusse and Elouan Le Ny, our two engineers in attendance, to discuss our areas of expertise,…

12/13/2021 2021 December iMIP Release II Atmospheric plasma decapsulation, a new cleaning method, and more recipe options.  More Green … … More options :).