ESREF 2017

10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA)  1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337  and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…

05/22/2025 We have show for the first time the results of DCapsulation with the new iMIP XL™ already installed at Customers Plants in 2024. This one allow to DCap a IC on large board (300x300mm). This is a World Premiere ;).  

07/7/2016 Digit Concept Asia Pacific will attend the 23rd International symposium on the Physical and Failure Analysis of integrated circuits (IPFA), that will take place in Marina Bay Sands, Singapore from 18th to 21th July 2016. All the DC Team we will be glad to meet you at our Booth A1-A3 and to show you our last products and…

09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA)  5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209  and to show you our last products.

06/01/2017 Welcome at IPFA 2017, we were please to meet you at our Booth #23 with our partner in Asia Ellipsiz. This year we were happy to show and share our latest Sesame products : Acid, Mechanical, Plasma and LASER Decap.

04/16/2019 Advanced decapsulation systems with  New SesameMICROMACHINING