CAM WORKSHOP 2023
08/22/2023

Thanks to all visitors and meet you soon.
08/22/2023

Thanks to all visitors and meet you soon.
07/16/2024 New for 2024 iMIP II XL™ Atmospheric DCapsulation of IC on Board. Maximum size 300x300mm (12″x12″)
04/16/2019 Advanced decapsulation systems with New SesameMICROMACHINING
07/01/2022 We was at CAM Workshop were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.
11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…
04/16/2019 iCEMIP introduction at IPFA2018 Singapore
09/29/2022 We was at ESREF were we demonstrated the SLP500™ LASER. iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too. Thanks to all for your visit.
You may have encountered difficulties reaching us from July 18 to 24, and we sincerely apologize for that.
We experienced some issues with our web host.
Fortunately, everything has been resolved, and we can once again be reached via our various email addresses.
Once again, we apologize for the inconvenience.