10/03/2015 Digit Concept will attend the 41st International Symposium for Testing and Failure Analysis, that will take place in Portland (Oregon, USA) 1-5 November 1-5, 2015. All the DC Team we will be gald to meet you at our Booth 337 and to show you our last products. Don’t miss our presentation during the session « Sample Preparation and Device…
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
03/18/2015 Digit Concept has been selected to participate to the Season 1 of the Fast Forward Normandie program and to accelerate his business development. More information … FFWD
11/01/2014 Digit-Concept participated in the 2014 edition of ISTFA, a major international event dedicated to test and failure analysis technologies. This participation gave the company an opportunity to showcase its expertise and innovative solutions in the field of electronics. ISTFA 2014 was also an excellent opportunity to meet industry professionals and key players in the…
11/01/2014 Digit-Concept participated in ESREF 2014, an international conference dedicated to reliability and failure analysis in electronic systems. This event provided an opportunity for the company to present its expertise and innovative solutions to a specialized audience. ESREF 2014 also enabled Digit-Concept to meet industry professionals, researchers, and key players in the field. The event…
11/01/2014 Digit-Concept participated in SEMICON China 2014, one of the leading international events for the semiconductor industry. This participation provided the company with an opportunity to showcase its expertise and solutions to professionals from across the semiconductor sector. The event brought together major industry players, technology providers, and experts from around the world. It was…
04/25/2013 The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results — especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final…
03/19/2013 Digit Concept Asia will be pleased to introduce our equipment for failure analysis and plasma treatment at SEMICON China 2013. Come and visit us at the booth #2812.