CAM Workshop 2022 June

07/01/2022
We was at CAM Workshop were we demonstrated the SLP500™ LASER.
iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too.
Thanks to all for your visit.

07/01/2022
We was at CAM Workshop were we demonstrated the SLP500™ LASER.
iMIP II™ Atmospheric Microwave DCapsulation Plasma and iSA777™ Acids DCapsulation was here too.
Thanks to all for your visit.
04/28/2015 DIGIT CONCEPT introduces the New SesameLASERPlasma™ (SLP). After 9 years of Research on combined LASER and Plasma Technology, DIGIT CONCEPT is pleased to announce the New SesameLASERPlasma™ (SLP), the Green way to decapsulate all types of IC with all types of wires materials (Al, Au, Cu, Cu/Pd, Ag …). The SLP500DC is based on our SL500DC…
09/14/2017 Digit Concept will attend the 43rd International Symposium for Testing and Failure Analysis, that will take place in Pasadena (California, USA) 5-9 November 1-5, 2017. All the DC Team we will be glad to meet you at our Booth 209 and to show you our last products.
11/25/2015 Digit Concept will attend the 17th Electronics Packaging Technology Conference, that will take place in Singapor, 2-4 December, 2015. All the DC Team we will be gald to meet you and to show you our last products. If you have questions on Cu or Ag wires decapsulation, don’t hesitate to ask us our recipes, or meet us during…
08/22/2023 Thanks to all visitors and meet you soon.
04/16/2019 Advanced decapsulation systems with New SesameMICROMACHINING
08/22/2023 Thanks for your welcoming and discussions about iMIP II™